Imec Demonstrates Scalable III-V and III-N Devices on Si Targeting advanced RF Front-End Modules

People holding smartphones in a blurred group setting, suggesting mobile connectivity and wireless communication
Diagrams and SEM images showing III-V nano-ridge HBT integration on silicon with emitter, base and collector layers.
Description of the NRE approach for hybrid III-V/CMOS integration on 300mm Si: (a) nano-trench formation; defects are trapped in the narrow trench region; (b) HBT stack growth using NRE and (c) different layout options for HBT device integration.
Chart of GaN/AlGaN devices on 200mm Si showing fT and fmax versus drain current for 300 nm gate length.
GaN/AlGaN devices on 200mm Si: measured cut-off frequencies of the current gain (fT) and of the unilateral power gain (fmax).

About imec

Imec is a world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, energy and education.

As a trusted partner for companies, start-ups and universities we bring together more than 4,000 brilliant minds from over 97 nationalities. Imec is headquartered in Leuven, Belgium and has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, and offices in China, India and Japan. In 2018, imec's revenue (P&L) totaled 583 million euro. Further information on imec can be found at www.imec-int.com.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Government of Flanders), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.), imec China (IMEC Microelectronics (Shanghai) Co. Ltd.), imec India (Imec India Private Limited) and imec Florida (IMEC USA nanoelectronics design center).

Discover more

Large semiconductor wafer beside a small comparison wafer, illustrating InP scale-up on silicon

Scaling up GaN- and InP-based technologies for 5G and 6G wireless communication

26/06/2023
Longread
Beyond 5G
GaN
Data- and telecom
Read more
3D render of a stacked reconfigurable chip with exposed circuitry on a dark background

SDSi: a new generation of workload-adaptable chips through reconfigurable computing

Page
Data- and telecom
Artificial intelligence
Read more
Diagram of a 2D cross-section of an InGaAs/InP device with labeled active region and 1 μm scale bar.

Imec introduces simulation framework to better predict thermal transport in RF devices for 5G and 6G.

06/12/2022
press release
Beyond 5G
Data- and telecom
Read more
Stylized blue circuit board with glowing traces and layered chip packages representing wireless connectivity

Advanced RF technologies

Page
Beyond 5G
Read more
Night city skyline with wireless connection arcs and a glowing tower

Heterogeneous integration technologies to enable the next generation of wireless 6G

16/11/2022
Longread
Beyond 5G
Data- and telecom
Read more
Hands holding a smartphone with a glowing 6G graphic overlay

To boost 6G energy efficiency, we need models that can handle its complexities

29/09/2022
Vision
Beyond 5G
Data- and telecom
Read more
Night cityscape overlaid with glowing network lines and nodes, suggesting connected 6G communication

To reap the rewards of 6G, we need to start sowing the seeds now

28/06/2022
Blog
Beyond 5G
Data- and telecom
Read more
Night cityscape overlaid with glowing network lines and nodes, suggesting connected 6G communication

It’s time to start imagining the kind of 6G we want

18/03/2022
Blog
Beyond 5G
Data- and telecom
Sustainable development
Read more
Close-up of a microchip die with dense metal traces and bonding pads

Imec researchers pioneer a compact 8-bit, 8GS/s time-interleaved SAR analog-to-digital converter, and a power-efficient 140GHz T/R front-end module

14/02/2022
Research update
Beyond 5G
Data- and telecom
Read more

imec in your region

Looking for information about imec's activities in different parts of the world?

United Kingdom
United States
Qatar