Connectivity technology
Build reliable, scalable, high-throughput and low-power network technologies by leveraging imec’s system-wide expertise.
Autonomous cars, smart medical implants, remote holography, ... All exciting future applications have at least one thing in common: they put new demands on our wired and wireless communication infrastructure.
To meet these demands, imec is working on next-generation connectivity technologies by innovating with novel semiconductor processes and across the system stack – from materials to circuits and algorithms – both in the analog and digital domains.
Watch the talk from imec expert Michael Peeters on the challenges of 6G pre-competitive research
We’re countering the low efficiency of CMOS when dealing with ultra-high frequencies through heterogeneous integration of III-V devices and advanced packaging to enable 6G. We enhance the accuracy and security of ultra-wide band and Bluetooth Low Energy through innovative algorithms and IC design, develop high-speed wireline. And much more.
Advanced RF technologies
Guided by concrete system needs, imec explores solutions to enable the next generation of wireless networking technology.
Low-power ADCs
Tap into our track record of designing ADCs that combine high performance with low power consumption.
ADPLL (all-digital phase-locked loop)
Use imec’s compact, ultra-low-power ADPLL to optimize your next-generation IoT radio.
Deterministic networking
Imec devises software strategies for networks that offer 100% reliability within strict latency bounds.
Integrated circuits for high-speed wireline transceivers
Explore how imec’s expertise helps you to achieve the +100Gbaud goal.
Ultra-wide band (UWB)
Use imec’s high-precision and low-power UWB positioning and tracking technology to design your next-generation IoT products.
Bluetooth Low Energy (BLE)
Explore the dependable, low-power and safe connectivity options that BLE enables.
Connected car technology
Compare and implement advanced technologies for a future where every car will have at least one high-speed wireless connection.
Some examples of what we have done
300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for high-performance RF and mixed-signal applications
Read moreIntegrated circuits for high-speed wireline transceivers
If we want optical transceivers to keep up with exploding data rates, all building blocks need to handle higher speeds. Imec’s combined expertise helps you to achieve that +100Gbaud goal.
Read more
Disruptive ‘Wi-Fi on steroids’ technology allows manufacturing industry to finally cut the cord
What if we could create a wireless network that comes with guaranteed performance? A network that combines the reliability and low latency of wired networks with the flexibility of wireless solutions, thus minimizing factories' downtime and maximizing operational efficiency?
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Source content: https://www.imec-int.com/en/5G-and-wireless-iot-communication
What can we do for you?
- Our industrial affiliation program (IIAP) connects you with imec’s global partner ecosystem including leading EDA and IP vendors and commercial foundries, enabling you to share costs and lower risk through collaborative and precompetitive research.
Why work with us?
- We are a world-recognized center-of-excellence with an extensive IP portfolio in low-power chip design, mm-wave IC and antenna design, advanced signal processing and data science techniques.
- Shorten your time-to-market through our offering in white box IP (intellectual property) licenses that includes technology transfer, training, support.
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