Nadine Collaert

Program Director of the Advanced RF Program
Author

Nadine Collaert is program director at imec and responsible for the High-speed analog/RF program. She received an M.S. and Ph.D. degree in electrical engineering from the ESAT Department, KU Leuven, Belgium, in 1995 and 2000, respectively. Since then, she has been involved in the theory, design and technology of FinFET devices, emerging memory devices, transducers for biomedical applications and the heterogeneous integration of new materials with Si.

Portrait of Nadine Collaert with long dark hair and glasses, standing in a softly blurred indoor setting.

Authored articles

Portrait of imec fellow Nadine Collaert smiling in front of a blurred office background

Meet imec fellow Nadine Collaert

31/10/2023
Academic Excellence

“To all the talented female researchers out there: make your voices heard loud and clear. Your ideas and insights matter.”

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Large semiconductor wafer beside a small comparison wafer, illustrating InP scale-up on silicon

Scaling up GaN- and InP-based technologies for 5G and 6G wireless communication

26/06/2023
Longread
Beyond 5G

GaN HEMTs and InP HBTs: integration on a Si platform and co-integration with CMOS components Keep me informed about imec's beyond 5G activities

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Night city skyline with wireless connection arcs and a glowing tower

Heterogeneous integration technologies to enable the next generation of wireless 6G

16/11/2022
Longread
Beyond 5G

InP shows promise to power 6G technology. Heterogeneous integration is key to its advancement, co-integrating all components into a cohesive system. Keep me informed about imec's beyond 5G activities

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Person using a smartphone with one finger tapping the screen

Heterogeneous III-V/CMOS technologies for beyond-5G RF front-end modules

09/01/2020
Beyond 5G

Keep me informed about imec's beyond 5G activities

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Colorful stacked semiconductor chip layers in a tall 3D structure

The potential of sequential-3D integration for advanced semiconductor scaling

30/05/2018

Sequential-3D integration is perceived as a promising alternative to continue the benefits offered by semiconductor scaling. Nadine Collaert (distinguished member of technical staff at imec) and her team review the technology integration challenges and the potential benefits of this emerging integration technology.

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Smiling child underwater holding a smartphone toward the camera

Tackling the challenges of 5G with hybrid III-V/Si technology

01/02/2018
Beyond 5G

Imec has recently launched ‘High-speed analog/RF’, a new Industrial Affiliation Program set up to develop 5G RF front-end technologies for mobile handsets. Together with material and equipment suppliers, IDMs, foundries and system companies, the program will take RF beyond the speed and power limits of CMOS technologies. Nadine Collaert, distinguished member of technical staff at imec and responsible for the High-speed analog/RF program, explains.

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Abstract dark gray stacked geometric blocks suggesting a dense chip architecture

The vertical nanowire FET: enabler of highly dense SRAMs

23/08/2017

Gate-all-around nanowire field effect transistors (FETs) in a vertical configuration bring many opportunities, such as the 'super-scaling' of SRAM memory cells.

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