ASIC manufacturing in CMOS

End-to-end ASIC solutions in mature to advanced nodes

Semiconductor wafer handled by robotic equipment in a cleanroom manufacturing line

Turnkey ASIC manufacturing for prototyping and high-volume production

IC-Link delivers a complete, flexible pathway to custom ASIC development—from concept to qualified silicon.

We leverage imec’s deep semiconductor R&D heritage and our membership in the TSMC Value Chain Alliance (VCA) to offer unparalleled access to the most advanced CMOS process technologies and a global ecosystem of design, manufacturing, and packaging partners.

Engineer reviewing chip design layout on dual monitors

Flexible engagement models for custom ASIC development

Whether you need a turnkey ASIC or a flexible engagement model, IC-Link provides the expertise and infrastructure to accelerate your design to production.

Our services span all stages of the ASIC lifecycle: specification, design enablement, foundry interface, wafer manufacturing, packaging, testing, and volume ramp.

Process-node compatibility chart showing available options for embedded NVM, RF, analog, logic, high voltage, BCD and SOI

Advanced and mature CMOS process nodes

Our close collaboration with TSMC and other commercial foundries enables our customers to gain early access to advanced process nodes—down to single-digit-nanometer CMOS logic technologies—along with a complete portfolio of wafer technologies, including mixed-signal, RF, high-voltage, and embedded memory options.

For cost-sensitive or specialized applications, we also support mature nodes optimized for power, performance, and reliability.

Scalable manufacturing and supply chain management

IC-Link’s scalable manufacturing model ensures seamless migration from prototype to high-volume production, with quality control and supply-chain management handled through imec’s established foundry relationships.

Regardless of the target end-market, ASIC customers benefit from imec’s decades of experience in scaling CMOS technologies and our deep understanding of design-for-manufacturability.

Assorted packaged microchips arranged on a white background

Accelerated ASIC innovation from lab to market

By bridging the gap between research, innovation and commercialization, IC-Link enables companies of all sizes to bring differentiated semiconductor solutions to market faster, at lower risk, and with the backing of one of the world’s most trusted names in nanoelectronics.

A selection of our ASIC development projects:

IC-Link: Turning your ASIC vision into silicon reality.

Reading room

Engineer reviewing chip design layouts on multiple monitors

IC-Link selected as a European Design Enablement Team (DET) under EuroCDP

26/05/2026
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3D rendering of stacked semiconductor chips and solder bumps for advanced packaging

IC-Link joins TSMC 3DFabric® Alliance

12/05/2026
press release
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AI chip connected to multiple smaller processor blocks by glowing data lines

ASIC vs GPU for AI

27/04/2026
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Futuristic data center corridor lined with server racks and blue lighting

IC-Link’s role in Celestial AI’s journey

07/04/2026
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Close-up of a semiconductor wafer with a blue and purple patterned photonics grid

IC-Link now also offers silicon nitride (SiN) manufacturing services through imec’s mature platform

19/03/2026
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Scanning electron microscope view of a high-density electrode array

Next-generation, permanent DNA-based data storage for the AI age

05/03/2026
press release
Venturing
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Silicon wafer with colorful chip patterns inside semiconductor equipment

Teradyne – using ASICs to build a competitive advantage

27/01/2026
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3D molecular structure rendered in gray, magenta, and orange against a dark background

Thermo Fisher Scientific – A unique custom chip for electron microscopy

27/01/2026
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Glowing secure chip illustration on a dark circuit board

Fortaegis – Developing the world’s most secure high-performance chip

19/01/2026
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