Abstract illustration of overlapping semiconductor wafer slices with a colorful blue-pink gradient background

IC-Link by imec

Customized solutions for innovative chip manufacturing

 

Gloved hands holding a semiconductor wafer with patterned chip dies

Streamline and accelerate your path from concept to production.

ASIC and photonic IC manufacturing

Turning an idea into silicon shouldn’t be limited by access, complexity, or scale. With more than four decades of experience, IC-Link makes it possible for companies of any size—from startups to global innovators—to bring their devices to life.

Through our extensive foundry network and technical infrastructure, we provide fast, reliable access to our end-to-end ASIC and integrated photonic IC (PIC) services.

In addition to ASICs and PICs, we offer access to custom wafer manufacturing processes, resulting in imagers and detectors, fine-resolution wafers, and CMOS post-processing implementations.

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Engineer reviewing chip design layout on dual monitors

Flexible engagement across the semiconductor value chain

You can engage with us across the entire semiconductor value chain—from design, IP selection and manufacturing, to advanced packaging, testing and qualification, and supply chain management—choosing between multi-project wafer (MPW) runs for cost-effective prototyping and dedicated full-mask production for volume scaling.

IC-Link manages the full design-to-manufacturing flow, ensuring each step meets your performance, yield, and reliability targets.

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Process-node compatibility chart showing available options for embedded NVM, RF, analog, logic, high voltage, BCD and SOI

ASIC Development from design enablement to production

For ASIC development, we support a range of geometries, from mature through advanced CMOS nodes, along with design enablement resources that include verified process design kits (PDKs), foundry-qualified IP, and a host of advanced packaging options.

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Turnkey and COT models for scalable IC manufacturing

IC-Link’s flexible business models accommodate varying project scales and budgets, whether you own your own tooling (COT) and are looking for a reliable wafer supply, or require our low-risk full-turnkey (FTK) model, where we manage the entire production process so that you can focus on your core business.

Each model provides cost control, IP security, and supply-chain facilitation.

Proven path from design to silicon

By combining proven process expertise, foundry relationships, and engineering infrastructure, IC-Link enables faster tape-out cycles, higher first-time-right success rates, and smoother transitions from R&D to production.

IC-Link by imec — Your complete path from design to silicon, backed by world-class technology access and integration.

Reading room

Engineer reviewing chip design layouts on multiple monitors

IC-Link selected as a European Design Enablement Team (DET) under EuroCDP

26/05/2026
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3D rendering of stacked semiconductor chips and solder bumps for advanced packaging

IC-Link joins TSMC 3DFabric® Alliance

12/05/2026
press release
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AI chip connected to multiple smaller processor blocks by glowing data lines

ASIC vs GPU for AI

27/04/2026
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Futuristic data center corridor lined with server racks and blue lighting

IC-Link’s role in Celestial AI’s journey

07/04/2026
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Close-up of a semiconductor wafer with a blue and purple patterned photonics grid

IC-Link now also offers silicon nitride (SiN) manufacturing services through imec’s mature platform

19/03/2026
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Scanning electron microscope view of a high-density electrode array

Next-generation, permanent DNA-based data storage for the AI age

05/03/2026
press release
Venturing
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Silicon wafer with colorful chip patterns inside semiconductor equipment

Teradyne – using ASICs to build a competitive advantage

27/01/2026
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3D molecular structure rendered in gray, magenta, and orange against a dark background

Thermo Fisher Scientific – A unique custom chip for electron microscopy

27/01/2026
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Glowing secure chip illustration on a dark circuit board

Fortaegis – Developing the world’s most secure high-performance chip

19/01/2026
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