How CCD-in-CMOS technology enables hyperspectral TDI imaging

TDI (time delay and integration) is a popular line scanning technique for applications such us as remote sensing, precision agriculture and machine vision in industrial environments. TDI is often achieved by CCD (charged-coupled device) technology, which traditionally required a board with multiple chips.

Imec managed to develop a solution that combines CCD pixels with CMOS readout into one technology. This combines the best of two worlds:

• highly sensitive TDI
• high level of integration

When spectral filters are deposited on top of these imagers, this results in fast hyperspectral imaging solutions with a high signal-to-noise ratio.

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