Stefaan Decoutere

Program director gallium nitride (GaN) and power electronics
Author

Stefaan Decoutere received the M.Sc. degree in electronic engineering and the Ph.D. degree from the Katholieke Universiteit Leuven, Belgium, in 1986 and 1992 respectively. He is with imec, Leuven, since 1987, where he started in high-voltage BCD technology development. From 1992 till 1997, he was in charge of the development of high-speed BiCMOS and SiGe HBT technologies. In 1998, he became the head of the mixed signal/RF technology group in imec. Since 2010 he manages the GaN power device technology development, and in 2015 he became the director of the GaN technology program. 
 

Stefaan Decoutere portrait in front of a modern glass building

Authored articles

Groene lichtpuntjes verspreid over horizontale lagen, als een abstract beeld van vloeistofgeheugen

Unlocking the full potential of GaN technology for next-gen power electronics

16/02/2026
Page-turner
GaN

Improving GaN device architectures, substrates, and IC design to boost power conversion efficiencies across industries.

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Portrait of imec fellow Stefaan Decoutere in a blue sweater and glasses

Meet imec fellow Stefaan Decoutere

31/10/2023
Academic Excellence

“Don’t only work out a topic in depth – develop a broad skillset that helps to put your work in a broader context”

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Close-up of a GaN transistor layout with source, gate and drain regions and a 350 µm scale bar.

Monolithic integration of GaN components boosts power integrated circuits

16/03/2022
Research update
GaN

The successful cointegration of high-performance Schottky barrier diodes and depletion-mode HEMTs on a 200V GaN-in-SOI power IC

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A red car drives along a snow-covered road through a winter forest, seen from above.

A new generation of power electronics will make electric cars more efficient and cheap

26/02/2019
GaN

European ‘HiPERFORM’ to introduce wide-bandgap power electronics in next-generation electric cars.

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Close-up of a grid of metallic chip-like circles reflecting light

Packaging solution for GaN-on-200mm Si power devices

30/05/2018
GaN

Imec and UTAC have developed a unique process for the wafer thinning and backside metallization of highly stressed GaN-on-200mm Si wafers. This has resulted in a packaged 650V GaN device – smaller than state-of-the-art.

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