Soon Aik Chew

He obtained a B. Eng. (Materials) from the Universiti Sains Malaysia in 2001 and an M.Sc. in Electrical and Electronics Engineering from the Universiti Teknologi PETRONAS in 2004. Before joining imec, he worked on process and device development with ASE, Silterra, SSMC and Altera (now part of INTEL PSG). He has been with imec since Sept. 2011, working on CMOS device middle-of-line (MOL) technologies; his current research focuses on wafer-to-wafer hybrid bonding technologies.