Shane (Shih-Hsiang) Lin
Shih-Hsiang Lin received his B.Sc. degree in electrical engineering from National University of Kaohsiung (NUK), Kaohsiung, Taiwan, in 2018, and his M.Sc. degree from National Cheng Kung University (NCKU), Tainan, Taiwan, in 2021. In addition, he spent one year as an intern at imec in 2021. He joined the department of electronics and informatics (ETRO) at the Vrije Universiteit Brussel (VUB) and the Electrostatic discharge (ESD) team at imec, Belgium, in 2021, where he is pursuing his PhD degree. His current research topic is ESD risk investigation in three-dimensional (3D) technologies.

Authored articles

Towards efficient ESD protection strategies for advanced 3D systems-on-chip
Guidelines for protecting the internal I/O interfaces from electrostatic discharge during die or wafer bonding steps
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