Melina Lofrano

Melina Lofrano is a research engineer in the thermal modeling and characterization team at imec. She holds an M.Sc. in mechanical engineering from the University of São Paulo, Brazil. In 2008 she joined imec, Belgium, where she has been working with thermal and mechanical analysis for micro and nanoelectronic reliability. Her activities cover multiple topics, including thermal and thermomechanical analysis of back-end-of-line interconnect, 3D IC assembly, chip package interaction, MEMS resonators, GaN devices, and non-linear material characterization. Currently, she works on thermal analysis for 3D system integration and is responsible for the nano IC thermal modeling and characterization activities