Joeri De Vos

Joeri De Vos is heading the 3D integration team at imec. He obtained a degree in electrical engineering in 1991 and a Ph.D. in Applied Sciences in 1999, both from the University of Ghent, Belgium. He has been with imec since 2000 with many years of experience in integrating flash memory, CMOS imagers and 3D demonstrators. The 3D integration team he leads focuses on scaling wafer-to-wafer hybrid bonding, BSPDN, and interposer technology.