Herman Oprins

Principal member of technical staff and R&D team leader at imec
Author

Herman Oprins is a senior research engineer at imec in Leuven, Belgium. He received the M.Sc and Ph.D. degrees in Mechanical Engineering from the K.U. Leuven, Belgium. He joined imec in 2003, pursuing the PhD degree, working on the development and modeling of an electrowetting assisted cooling technique. In that period he also worked on modeling and experimental projects in the field of thermal management of electronic packages. Since 2009 he is a senior research engineer in imec, where he is involved in the thermal experimental characterization, thermal modeling and thermal management of 3D system integration, electronic chip packages, BEOL, Si photonics and GaN power transistors.

Portrait of Herman Oprins in a suit and tie against a brick wall

Authored articles

Groene lichtpuntjes verspreid over horizontale lagen, als een abstract beeld van vloeistofgeheugen

Mitigating the thermal bottleneck in advanced interconnects

28/09/2023
Longread
Interconnects

A modeling framework to accurately predict heat dissipation in the chip’s back-end-of-line

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Close-up of clear liquid cooling droplets on a metal surface

A cold shower for chips

06/02/2019

Can 3D printing provide a cost-effective solution for cooling electronics?

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