IC-Link: one access and service point for the scalable and reliable manufacturing of semiconductor products

Connecting technological advances with their real-life impact has always been the core of imec’s mission. We do that as an independent research hub, but also, through IC-Link, as a service provider for custom chips on commercial-grade silicon.

For decades, IC-Link has enabled access to advanced ASIC manufacturing at leading foundries, even at the most cutting-edge nodes. The offering includes a full suite of services that augment or replace in-house capabilities: from technology selection to design and IP, assembly and packaging, testing and qualification, and supply chain management. These are available through two customizable business models: customer owned-tooling (CoT) and full-turnkey (FTK).

Download IC-Link's practical guide to ASICS

But there are industry needs that require additional technologies besides cutting-edge ASICs:

• In telecom, datacom, and high-performance (AI) computing, innovators require not just advanced nodes, but also 3D integration, and integrated photonics to overcome I/O bottlenecks.
• In medical and industrial applications, miniaturization and specialized 3D integration are often essential, while volumes are generally limited.
• The automotive industry's transition to software-defined vehicles calls for advanced CMOS and chiplet-based compute architectures.
• Semiconductor equipment manufacturers drive their fab equipment to the limit to support the fabrication of the most advanced nodes. Fine-resolution-patterned wafers and specialized test wafers are a necessity for tool calibration (EUV, metrology, deposition) and validation.

These advanced and hybrid technologies should be just as accessible as standard CMOS ASICs. That’s why we’re expanding IC-Link with new services and technologies, making sure our customers can fluently transfer their ideas into innovative products.

A larger innovation toolbox

To make it even easier for our customers to get access to the most advanced commercially available CMOS nodes and advanced packaging schemes, we’re expanding our in-house ASIC team, including designers with experience down to TSMC N2.

Additionally, we’re investing in IP blocks that stem from our research activities. Through the years, the imec research groups have developed groundbreaking research IP. We’re now hardening it, so it can be effortlessly integrated into our customers’ designs.

Another source of IP, specifically for automotive chiplets, is the Advanced Chip Design Accelerator (ACDA), a recently-launched imec competence center at Baden-Württemberg (Germany).

Perhaps most notably, IC-Link’s support will now extend beyond-CMOS technologies:

• We’re introducing advanced technology platforms that have been validated for commercial use, starting with our advanced integrated photonics platform.
• We will continue to expand the offering with new technologies, such as ultra-low-loss silicon nitride, which we’re aiming to bring to IC-Link’s portfolio in Q1 2026. This technology will enable amazing applications from quantum and AR/VR to sensors.
• The 3D offering in our ASIC services via our partners will be joined by imec-developed advanced 3D packaging.
• Finally, IC-Link will also offer access to manufacturing capabilities that do not have a standard flow, so-called specialty technologies, such as CMOS post-processing, enabling the volume production of on-chip integration of specialized sensors and detectors. On top of this, access to imec’s pilot line will grant a path to advanced process capabilities, such state-of-the-art lithography (EUV), fine-pattern-resolution wafers, and non-standard substrates.

The goal is to enable a steady transition of R&D process flows to mature platforms that can be used for prototyping and manufacturing, supported by a range of specialized services.

The production is mostly done at partner foundries, in specific cases in the imec cleanrooms, but always through one point of contact: IC-Link.

Hybrid technology integration to propel deep-tech innovation

Groundbreaking innovation increasingly depends on combining multiple advanced technologies into a single, manufacturable solution. With its growing toolbox of platforms and services, IC-Link supports not only the realization of each technology, but also the powerful synergies between them.

In short, with IC-Link as key enabler of customized solutions for innovative chip manufacturing, imec takes an exciting new step towards connecting research to commercial products.

Ready to bring your next-gen semiconductor idea to life? Click the contact button below to start a conversation with our team.