Imec’s high-speed ultrasonic SNAPSCAN camera enables hyperspectral imaging acquisition in less than one second

29/01/2018
press release
Hyperspectral camera setup with a laptop displaying color analysis charts and sample images

SAN FRANCISCO — Jan. 29, 2018 – Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, today announced that it will demonstrate at this week’s SPIE Photonics West in San Francisco its second generation high-speed SNAPSCAN hyperspectral imaging camera. The new hyperspectral camera uses an ultrasonic speed piezo motor stage and innovative software to enable the acquisition of high resolution hyperspectral images in less than 200ms. It will enable our partners to develop consistent spectral libraries and customized solutions faster than ever possible before, and this for a wide range of new applications in the medical market.

The SNAPSCAN hyperspectral camera is a proprietary breakthrough system concept initially introduced by imec one year ago. It combines a high signal-to-noise ratio and high spatial and spectral resolutions with the user friendliness of a snapshot hyperspectral imaging camera.

“We have been thrilled by the commercial success of the first generation SNAPSCAN camera which was introduced at SPIE Photonics West 2017,” explained Andy Lambrechts, program manager for integrated imaging activities at imec. “By introducing an ultrasonic speed piezo motor stage, we can now guarantee image acquisition times of less than a second, and thus minimize the effects of motion artifacts during acquisition. As a result, we can now enable many more key applications such as digital pathology, wound healing, skin diagnostics and guided surgery.”

Imec’s new SNAPSCAN camera handles all scanning internally using the miniaturized ultrasonic piezo scanning stage, thereby excluding the need for external scanning movement. Today, spatial resolution of 3,650 x 2,048px (7MPx), with a spectral resolution of 150+ spectral bands can be reached over the VNIR spectral range (470 – 900nm) and the NIR range (600 – 975nm). With imec’s proprietary hyperspectral imaging acquisition software, specific spectral regions of interest can now be selected, which enables acquiring images at a very high speed of only 200ms. Flat signal-to-noise ratios of 200:1 over the full spectral range are in reach, with optimized acquisition and lighting set-up parameters.

“We believe our new high-speed ultrasonic SNAPSCAN camera technology will further open the market for all users who intend to bridge the gap between academic research and commercial development. The second generation ultrasonic high-speed SNAPSCAN camera ability to easily create high quality datasets will enable our partners to move from initial application validation to building consistent spectral libraries and application solutions faster than ever possible before,” explains Jerome Baron, business development manager at imec’s integrated imaging and vision system teams. “With a full year of commercialization under our belts, we have validated many clear commercial opportunities beyond the R&D market such as the medical market.”

Imec’s ultrasonic SNAPSCAN hyperspectral imaging cameras are demonstrated for the first time at SPIE Photonic West, booth #4321 in the North Hall of the Moscone center in San-Francisco and will be commercially available in April 2018.
 

Hyperspectral camera setup with a laptop analyzing samples on a lit platform
Imec’s ultrasonic SNAPSCAN hyperspectral imaging camera full demo kit configuration with lighting, tripod mounts and HSI acquisition software

About imec

Imec is the world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, energy and education.

As a trusted partner for companies, start-ups and universities we bring together close to 3,500 brilliant minds from over 70 nationalities. Imec is headquartered in Leuven, Belgium and has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, China, and offices in India and Japan. In 2016, imec's revenue (P&L) totaled 496 million euro. Further information on imec can be found at www.imec-int.com.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited), imec Florida (IMEC USA nanoelectronics design center).

Contact

Hanne Degans, Press communications manager, +32 16 28 17 69 // +32 486 06 51 75 // Hanne.Degans@imec.be

Discover more

Portrait of imec fellow Mircea Dusa in a white polo shirt against a leafy green background

Meet imec fellow Mircea Dusa

04/08/2026
Read more
Illustration of Earth connected by glowing data streams to microchips, wafers, and server racks

How hyperscalers are rethinking AI infrastructure

06/08/2026
Technology review
Interconnects
Read more
Hands holding a silicon quantum chip with the Diraq logo

Imec and Diraq demonstrate first coherent operation of eight silicon MOS spin qubits fabricated in a 300mm CMOS-compatible foundry process

13/07/2026
press release
Quantum computing
Read more
Row of vials moving along a biomanufacturing conveyor in a bright lab setting

Biomanufacturing innovations for complex therapeutics

15/07/2026
Vision
Biomanufacturing
Read more
Stylized carbon nanotubes extending from a chip surface, overlaid with DNA and molecule graphics

Towards scalable single-molecule biosensing using carbon nanotube FETs

22/07/2026
Featured in the media
Health & life science
Read more
Stylized brain with digital circuitry and a neural chip, suggesting brain-signal telemetry and wireless data transfer

Neural telemetry breakthrough: new chip delivers ten-fold compression while preserving signal integrity

02/07/2026
Research update
Neurotechnology
Read more
Researcher in a cleanroom using a microscope at a metrology workstation

Four decades of in-fab metrology and inspection: pivotal milestones, and the road ahead

27/07/2026
Technology review
Patterning
Read more
Gloved hands holding a printed chip layout with multiple die blocks

When does it make sense to move from a monolithic ASIC to a chiplet-based design?

23/06/2026
Longread
CMOS: advanced & beyond
Read more
Cross-sectional micrograph of a ferroelectric memory device structure with a central dark pillar and 200 nm scale bar.

Imec achieves breakthroughs in ferroelectric memory research for next-generation memory solutions to meet AI-era data needs

17/06/2026
press release
Memory & storage
Read more

imec in your region

Looking for information about imec's activities in different parts of the world?

United Kingdom
United States
Qatar