Imec Introduces Broad Spectrum Hyperspectral Imaging Solutions

15/02/2016
press release
Close-up of a CMOS image sensor chip in a black package with visible gold contact pins

SAN FRANCISCO (USA) and Leuven (Belgium) – Feb. 15, 2016 – At this week’s SPIE Photonics West, imec will present a new set of hyperspectral sensor and camera solutions with extended spectral range, going from the visible light (VIS) up to near infrared (NIR). The new line-scan VNIR (visible to near-infrared) sensor and snapshot mosaic VNIR camera outperform current solutions in spectral range and compactness. 

Example applications for the line-scan sensor are machine vision and remote sensing applications, e .g. precision agriculture using UAVs and satellites. It features 140+bands in the 470-900nm range. Its small form factor is the result of extreme integration of the hyperspectral filter onto the CMOS sensor. 

“Leveraging our learnings from previous versions of our line-scan hyperspectral sensor, we developed a new process that enabled us to deposit spectral filter banks in both the visible and near infra-red range on the same CMOS sensor. This achievement extends our sensing solutions within medical, precision agriculture, remote sensing and industrial applications;” explains Andy Lambrechts, Program manager integrated vision solutions at imec. 

Imec’s 450-875nm snapshot dual-sensor camera targets applications where dynamc effects are imaged: especially medical, machine vision and security surveillance. By integrating, within one single unified dual-sensor camera architecture, a 16-bands 4x4 mosaic sensor covering the 450-600nm range together with a 25-bands 5x5 mosaic sensor covering the 600-875nm range, imec realized a solution that covers a broad spectral range from visible to near-infrared while maintaining high spatial and spectral resolution tradeoffs.

“Working closely with two of our camera partners, VRmagic and Cubert Gmbh, we have realized one of the most advanced snapshot hyperspectral imaging cameras. It captures 40+ bands ranging from 450-875 m, at video-rate speed acquisition. This achievement clearly sets a new milestone for the real-time snapshot hyperspectral imaging camera market;” explains Jerome Baron, Business development manager integrated imaging at imec.

Imec’s new line-scan (visible to near infrared) VNIR sensor and snapshot mosaic VNIR camera will be demonstrated at Booth 4144 at SPIE Photonic West exhibition and will be available for early sampling to strategic partners from April 2016.

Discover more

Portrait of imec fellow Mircea Dusa in a white polo shirt against a leafy green background

Meet imec fellow Mircea Dusa

04/08/2026
Read more
Illustration of Earth connected by glowing data streams to microchips, wafers, and server racks

How hyperscalers are rethinking AI infrastructure

06/08/2026
Technology review
Interconnects
Read more
Hands holding a silicon quantum chip with the Diraq logo

Imec and Diraq demonstrate first coherent operation of eight silicon MOS spin qubits fabricated in a 300mm CMOS-compatible foundry process

13/07/2026
press release
Quantum computing
Read more
Row of vials moving along a biomanufacturing conveyor in a bright lab setting

Biomanufacturing innovations for complex therapeutics

15/07/2026
Vision
Biomanufacturing
Read more
Stylized carbon nanotubes extending from a chip surface, overlaid with DNA and molecule graphics

Towards scalable single-molecule biosensing using carbon nanotube FETs

22/07/2026
Featured in the media
Health & life science
Read more
Stylized brain with digital circuitry and a neural chip, suggesting brain-signal telemetry and wireless data transfer

Neural telemetry breakthrough: new chip delivers ten-fold compression while preserving signal integrity

02/07/2026
Research update
Neurotechnology
Read more
Researcher in a cleanroom using a microscope at a metrology workstation

Four decades of in-fab metrology and inspection: pivotal milestones, and the road ahead

27/07/2026
Technology review
Patterning
Read more
Gloved hands holding a printed chip layout with multiple die blocks

When does it make sense to move from a monolithic ASIC to a chiplet-based design?

23/06/2026
Longread
CMOS: advanced & beyond
Read more
Cross-sectional micrograph of a ferroelectric memory device structure with a central dark pillar and 200 nm scale bar.

Imec achieves breakthroughs in ferroelectric memory research for next-generation memory solutions to meet AI-era data needs

17/06/2026
press release
Memory & storage
Read more

imec in your region

Looking for information about imec's activities in different parts of the world?

United Kingdom
United States
Qatar