Dragomir Milojevic
Dragomir Milojevic received his Masters and Ph.D. degree from Université libre de Bruxelles (ULB), Belgium, where he holds professor position in the Electrical Engineering departement since 2005. In 2004 he joined imec where he first worked on SoC architectures for low-power multimedia systems. Since 2008 he is working on design enablement for 3D stacked integrated circuits. Today, part of INSITE & 3D integration programs, he is working on system and design technology co-optimization of advanced technology nodes and design methodologies and tools for technology aware design of 3D integrated circuits.
Authored articles
Imec highlights benefits of 3D-SOC design and backside interconnects for future high-performance systems
3D system-on-chip (3D SOC), enabled by electronic design automation (EDA) and 3D process technologies, is an attractive heterogeneous integration approach for addressing the memory wall in high-performance systems. Further performance gains at the system level can be achieved when the backside of one of the integrated wafers is exploited for either power delivery, signal routing or both. In this article, Dragomir Milojevic, Geert Van der Plas and Eric Beyne shed light on these promising approaches. The benefits of 3D-SOC design and of backside interconnects in specific circuits are highlighted in two papers presented at the 2021 IEEE International Electron Devices Meeting (IEDM).
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