Christopher Hunat
With over 23 years of experience in the semiconductor industry, Christopher has held key roles across several leading technology companies like Apple, Philips Semiconductors, NXP, STM, Socionext and imec. He has successfully led cross-functional teams, managed complex 2.5D packaging projects, and driven innovation in areas such as substrate design, signal and power integrity analysis.
Christopher is working as Package Development & Assembly Engineering Manager, under Product Engineering (DSRD) at imec which provides service in terms of developing a packaging solution optimized for customer design and assembly requirements,
Authored articles
When does it make sense to move from a monolithic ASIC to a chiplet-based design?
A journey into the benefits, trade-offs and technical implications of moving to chiplets
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