Arnita Podpod

Arnita Podpod graduated with a master degree in Materials Science and Engineering, and with a bachelor degree in Applied Physics from University of the Philippines. After graduation, she started at NXP Semiconductors as a Project (Materials) and Process Engineer, and progressed to being a Senior Package Development Engineer with Fairchild Semiconductor Phils. Arnita joined imec in 2013 as a Senior R&D Engineer and is currently responsible for both Flip Chip on FO-WLP projects and Pre-Assembly module integration within the imec 3D program.