SEMI-THERM 2026
At SEMI-THERM 2026
For SEMI-THERM 2026, the seeded copy focuses on thermal management, packaging pressure, and the engineering tradeoffs that come with higher performance and denser integration.
That gives imec a sensible placeholder angle to talk about measurement, reliability, and cooling-aware design choices across advanced electronic systems.
Thermal performance, reliability, and integration constraints are the obvious lead topics.
Relevant to teams balancing power density with long-term system stability.
A practical context for discussing how imec research supports real hardware decisions.