OFC 2024
Quantum Networking, AI, Data Center Connectivity and so much more!
Imec
Imec has seven contributions at OFC, including one invited and one top scoring paper, showing progress in research on advances in components and subsystems for data centers and optical networks, and passive optical devices for switching and filtering.
Visit us at booth 4305 to talk about our research in Si/SiN photonics, optical interconnects, heterogeneous integration.
Additionally, imec is organizing ITF Photonics USA 2024 on March 24, in Hilton San Diego Bayfront Hotel. At this event, experts from imec and industry will share first-hand insights on the rapidly evolving R&D and challenges of integrated photonics, and on innovative solutions in various application domains.
Highlights
In a top scored paper, imec will present a compact 32-channel silicon-based wavelength filter with low loss and high tuning efficiency, enabling a 4x increase in the number of transmitted and received wavelength channels, compared to today’s commercial transceivers.
Overview imec contributions
24 March, 2024
- Workshop - Co-Packaged Optics: Is it Only for the Cloud or Also for the Edge AI Services?, with Joris Van Campenhout, fellow at imec, as speaker in session 2
25 March, 2024
- Paper - Sub-pJ/MAC Silicon Photonic GeMM for Optical Neural Networks Using a Time-Space Multiplexed Coherent Xbar (M4C.3), Stefanos Kovaios, Aristotle University of Thessaloniki (co-authored by imec)
- Paper - Low-Loss, Multi-Reticle Stitched SiN Waveguides for 300mm Wafer-Level Optical Interconnects (M4A.3), Pengfei Xu imec
26 March, 2024
- Paper - 50G Burst-Mode Receiver Using Monolithic SOA-UTC and Burst-Mode TIA (Tu3H.1), Laurens Breyne Nokia Bell Labs (co-authored by imec)
- Invited - Sigma-Delta Radio Over Fiber (Tu3K.5), Piet Demeester Ghent University – imec
- Paper - Collective Die-to-Wafer Bonding Enabling Low-Loss Evanescent Coupling for Optically Interconnected System-on-Wafer (Tu3A.4), Pengfei Xu imec
27 March, 2024
- Top scored paper - 32×100 GHz WDM Filter Based on Ultra-Compact Silicon Rings With a High Thermal Tuning Efficiency of 5.85 mW/π (W1A.3), Qingzhong Deng imec
- Paper - Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics (Th2A.27), Jef Van Asch Ghent University (co-authored by imec)
