ESTC 2026

Imec will be participating in the 11th IEEE ESTC. The IEEE ESTC conference series is the premier venue for academics and industry to present and discuss the latest developments in electronics packaging, Covering a wide range of up-to-date topics in electronics packaging and system integration. Presentations are shown of leading edge research and development results related to those topics.

PRESENTATION(S)

• KEYNOTE
  • 'Next-Generation Silicon Photonics powering future AI Compute'
    Joris Van Campenhout, Program director optical input/output (I/O)
    Thursday, September 10, 2026
• PRESENTATION
  • 'A Fan-out RDL-first Process Flow using Temporary Glass Carriers';
    'Wet passivation assisted fluxless thermocompression bonding for microbumps pitches down to 5 µm'
    John Slabbekoorn, 3D wafer level packaging engineer
    Wednesday, September 9, 2026
  • 'Wafer-to-Wafer Hybrid Bonding to enable aggressive qubit pitch fan-out'
    Lieve Bogaerts, R&D Engineer
    Thursday, September 10, 2026
  • 'Thermal and superconducting interconnects for quantum computing';
    'Wet passivation assisted fluxless thermocompression bonding for microbumps pitches down to 5um';
    'Reliability evaluation of solder joints formed by TCB with insitu plasma cleaning'
    Jaber Derakhshandeh, Principal Member of Technical Staff
    Thursday, September 10, 2026
• POSTER
  • Capillary Underfill Process Optimization for Fine‑Pitch, Narrow‑Gap Packaging Under Short‑Side Constraints
    Mahan Morshedpour, Process Engineer in Wafer Bonding and Assembly team

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