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Advanced packaging for medtech devices

Packaging decisions increasingly determine whether miniaturized medical systems can combine sensing, compute, power management, and reliability in a form factor clinicians can actually use.

Published on 20/02/2026

Why packaging matters more than ever

Implantable and wearable devices now push several integration problems into the same compact system. Advanced packaging becomes the layer where biocompatibility, thermal constraints, signal integrity, and manufacturability need to work together.

For imec, this topic connects semiconductor process knowledge with translational engineering: turning promising device research into medical hardware that can survive practical deployment and regulatory scrutiny.

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